Samsung Electronics signed a Memorandum of Understanding (MoU) with AMD to supply and partner on next-generation AI memory.

To strengthen their position in the growing industry of AI chips, Samsung Electronics and Advanced Micro Devices have signed ...

Micron confirms AI-optimized memory and storage technologies are in production - HBM4 memory, SOCAMM2, and PCIe Gen6 SSDs - ...

On Tuesday, Apple introduced M5 Pro and M5 Max, debuting a dual-die Fusion Architecture that pushes Apple Silicon further ...

Samsung to supply HBM4 for AMD’s Instinct MI455X AI accelerators. Samsung, AMD to co-develop DDR5 for next-gen EPYC ...

The Rambus HBM4E memory controller extends a long-standing Rambus leadership position in HBM controller IP. Being first to ...

The new HBM4E Controller builds on Rambus’s track record of more than 100 HBM design wins and the company’s long-standing ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of ...

NVIDIA has launched the new compact single-slot RTX PRO 4500 Blackwell Server Edition with 32GB of GDDR7 memory for servers ...

New market research suggests memory prices may not drop even in the second half of 2027, as demand from AI infrastructure ...