Renesas Develops Bluetooth Low Energy RF Transceiver Technologies That Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency Announced at ISSCC 2022: Impedance Tuning and Reference ...

A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead of the usual bipolar ...

TDC has launched a Bluetooth module with an open-field range of one kilometre from its internal antenna, the longest range of any Bluetooth module. The range can be further extended by adding high ...

Time-to-market will be more important than ever in the highly competitive Bluetooth applications market. Zeevo Inc. (formerly Telencomm Inc.) now gives you a chance to be early—maybe even first—with ...

The market for Mobile Internet Devices – the new class of Internet-connected products offering “always-on” Web browsing, photography and video, navigation, games, social networking and voice ...

Announced at ISSCC 2022: Impedance Tuning and Reference Signal Self-Correction Technologies Can Facilitate Bluetooth LE Implementation in IoT Devices TOKYO, Japan ― February 24, 2022 -- Renesas ...

SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new single-chip Bluetoothâ„¢ large scale integration (LSI) that integrates radio frequency ...